The padstack for a laser-ablated via can have a smaller pad on the tapered end than on the large (the starting point) end. Therefore, laser-ablated holes are only feasible in build-up manufacturing. ![]() In contrast, a drilled hole can have an aspect ratio of 10:1 or greater (or less for some board houses). Partly because of this, a laser- ablated hole can not have an aspect ratio greater than 1:1. Ablation (u-BLAY-shən) Pronunciation Key noun (In the context of "laser ablation" in the making of blind and buried vias) Vaporization.Ī PCB designer should be aware that a hole caused by ablation has an inverted cone shape rather than a cylindrical shape, as would be the case with a hole drilled with a bit.
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